Designed for 1.0-mm-pitch BGA chips, such as the Renesas 256 PBGA and Cypress 256 FBGA, the SS-BGA256E-01 BGA socket operate at bandwidths up to 10 GHz with less than 1 dB insertion loss. Heat ...

The Giga-snaP 1-mm-pitch BGA surface-mount feet adapter enables socketing of 1-mm BGA chips. An epoxy-overmolded female socket is soldered to the pc board, and mates with a corresponding male-pin BGA ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

TOKYO – Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates. The new line will come online in January.

Greenliant has recently announced the release of its NVMe NANDrive BGA SSDs, a new line of solid-state drives designed to endure the harshest environments while delivering exceptional performance.

The company's micro BGA and CSP test and burn-in sockets can accept devices measuring 13 x 13 mm with a pitch of 0.5 mm or larger in applications operating up to 1 GHz. Both sockets employ solderless, ...

Upgrading RAM on most computers is often quite a straightforward task: look up the supported modules, purchase them, push a couple of levers, remove the old, and install the new. However, this project ...

BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with wafer-level chip ...

Intel hasn't revealed much about its upcoming desktop platform, codenamed Arrow Lake. It will replace Raptor Lake in the company's lineup and use an all-new socket dubbed LGA 1851. Despite Intel's ...