Bolstering high-end substrate production capabilities to meet semiconductor needs for AI and data centers December 17, 2025 - ...
TOKYO – Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates. The new line will come online in January.
Samsung Electro-Mechanics and LG Innotek are accelerating their AI semiconductor substrate businesses. Samsung Electro-Mechanics recently started operating its Vietnam flip chip-ball grid array ...
The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...
Samsung Electro-Mechanics and LG Innotek are focusing on the high-value semiconductor substrate "flip chip ball grid array" (FC-BGA) to diversify their business portfolios. But as Taiwan's TSMC, the ...
Gigavis is showing strong performance. It appears that the analysis predicting the establishment of a dominant position in glass substrates, such as flip-chip ball grid array (FC-BGA), is influencing ...
CARROLLTON, Tex. — A spin-off of Amkor Technology Inc. in Texas is quietly developing and producing a new class of substrates that could accelerate the development of true system-in-packaging (SIP) ...
SEOUL, South Korea, Feb. 2, 2023 /PRNewswire/ -- LG Innotek (CEO Jeong Cheol-dong) is accelerating the business activities in full-scale for targeting the Flip-Chip Ball Grid Array (hereafter referred ...
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