Toshiba aims to strengthen position as leader in semiconductor innovation, and accelerates development of next-gen power ...

November 18, 2012. Coventor Inc., a supplier of design-automation software for developing micro-electromechanical systems (MEMS), has introduced the MEMS+ 3.0 design platform, the latest version of ...

Siemens has introduced Siemens’ electronic design automation software to enhance its power devices and analogue semiconductor ...

A new software combines connectivity, scalability and data-driven artificial intelligence (AI) capabilities to push the boundaries of the IC verification process and make chip design teams more ...

HSINCHU, Taiwan--(BUSINESS WIRE)--SpringSoft, Inc., a global supplier of specialized IC design software, today launched the Verdi Interoperability Apps (VIA) Exchange, an open platform for creating ...

The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...

Skilled engineers remain the driving force for innovation in chips. But it’s no secret that electronic design automation (EDA) companies are folding AI into more of their offerings to speed up design ...

Long-Term Collaboration Supports Industry Transition to Interoperable PDK; First Development Milestone Delivers SpringSoft Laker 65nm CMOS PDK HSINCHU, Taiwan -- June 22, 2009 -- SpringSoft, Inc.

In the process of creating ICs, the digital implementation stage is focused on meeting the performance, power, and area (PPA) targets defined for the design. Traditionally, when talking about PPA ...

Cadence Design Systems, Inc. (Nasdaq: CDNS) and Saigon High-Tech Park (SHTP), the leading high-tech hub in Vietnam, today announced a collaboration to foster electronic design expertise and advance ...