Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...

Austria-based AT&S AG, a major player in the PCB and IC substrate industry, has announced the establishment of a new Information Technology Shared Service Centre (IT ...

For 2025, Zhen Ding Tech chairman Charles Shen pointed out that four major product applications are expected to grow simultaneously, with the IC substrate business showing the most significant growth.

An FCBGA substrate is a type of semiconductor packaging that employs Flip Chip technology to mount an integrated circuit (IC) directly onto the substrate using solder bumps. This method enhances ...

DuPont de Nemours, Inc. DD has unveiled a comprehensive portfolio of cutting-edge circuit materials and solutions at the 2025 ...

Onto Innovation and LPKF are set to accelerate mass production of glass core substrates for semiconductors LPKF joins Onto Innovation’s Packaging Applications Center of Excellence (PACE) Collaborating ...

The loan supports investment in a modern integrated circuit (IC) substrate plant in Kulim, Malaysia. The 250 million US-dollar loan will come directly from IFC; an additional up to 150 million US ...

DuPont is applying its decades of expertise in material science to meet the rising needs of the rapidly expanding IC substrate and high-end PCB market, driven by the rise of AI servers ...

The loan supports investment in a modern integrated circuit (IC) substrate plant in Kulim, Malaysia. The 250 million US-dollar loan will come directly from IFC; an additional up to 150 million US ...