For 2025, Zhen Ding Tech chairman Charles Shen pointed out that four major product applications are expected to grow simultaneously, with the IC substrate business ...

An FCBGA substrate is a type of semiconductor packaging that employs Flip Chip technology to mount an integrated circuit (IC) directly onto the substrate using solder bumps. This method enhances ...

DuPont is applying its decades of expertise in material science to meet the rising needs of the rapidly expanding IC substrate and high-end PCB market, driven by the rise of AI servers ...

The loan supports investment in a modern integrated circuit (IC) substrate plant in Kulim, Malaysia. The 250 million US-dollar loan will come directly from IFC; an additional up to 150 million US ...

The object exists exactly as it was defined. For an IC, this would be chip-up orientation, with the pins facing up (if sitting on/above the top substrate layer, this means they face AWAY from the ...

Taiwan-based makers have established an alliance targeting the supply of glass substrates, potentially a game changer for semiconductor packaging. Printed circuit board (PCB) and IC substrate ...

Embedded die packaging is different than most package types. Generally, in many IC packages, the devices are situated on top of a substrate. The substrate serves as the bridge between the devices and ...