Taiwan's top PCB supplier Zhen Ding Technology will focus more on high-end IC substrates, particularly ABF substrates, to bolster its future revenue growth amid persistently strong market demand, ...
As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply ...
The "Advanced IC Substrates Market Size, Share & Industry Analysis Report By Type, By Technology, By Application, By Regional Outlook and Forecast, 2025-2032" report has been added to ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
AT&S is one of the globally leading manufacturers of high-end printed circuit boards and IC substrates, headquartered in Austria and with a manufacturing footprint in Europe and Asia. The company ...
The "Global Advanced IC Substrate Market 2025-2035" report has been added to ResearchAndMarkets.com's offering. The global advanced IC substrate market is undergoing a significant transformation, ...
Korea JoongAng Daily on MSN
LG Innotek develops next-gen substrate for smart cards, cuts carbon emission by half
LG Innotek has developed a next-generation smart IC (integrated circuit) substrate, a core component in smart cards, that ...
Yonhap News Agency on MSN
LG Innotek develops next-gen smart IC substrate with half of manufacturing emissions
LG Innotek Co., a major South Korean electronics parts maker, has developed a next-generation smart integrated circuit (IC) ...
While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...
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