Korea JoongAng Daily on MSN
LG Innotek develops next-gen substrate for smart cards, cuts carbon emission by half
LG Innotek has developed a next-generation smart IC (integrated circuit) substrate, a core component in smart cards, that ...
Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
IC substrate and PCB maker AT&S (Advanced Technologies & Solutions) has been expanding its IC substrate manufacturing footprint in Asia before COVID-19 outbreak. It has moved equipment into the latest ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corusâ„¢ direct imaging platform and introducing the Serenaâ„¢ direct imaging ...
While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...
As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...
The Chosun Ilbo on MSN
LG Innotek’s smart IC substrate halves carbon emissions, boosts durability
LG Innotek announced on the 10th that it has successfully developed a ‘next-generation smart IC (integrated circuit) substrate’ that enhances performance while reducing carbon emissions by half ...
For 2026, the company said the order-Intake outlook is about 20% higher compared to 2025. Three reinforcing growth vectors in place, the company said: ...
Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...
The "The Global Market for Glass Substrates for Semiconductors 2026-2036" report has been added to ResearchAndMarkets.com's offering. The Global Glass Substrate for Semiconductors Market 2026-2036 ...
The semiconductor is a highly integrated device that cannot be connected directly to the main board in the way that condensers or resistors can. Therefore, a packaging substrate (or intermediary layer ...
South Korea's leading IC design company, LX Semicon, is reportedly downsizing its Silicon Carbide (SiC) semiconductor R&D operations. Save my User ID and Password Some subscribers prefer to save their ...
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