The IC substrate sector is predicted to return to growth in the second half of 2024, with the growth momentum continuing in 2025, according to industry sources. Save my User ID and Password Some ...
The "Global Advanced IC Substrate Market 2025-2035" report has been added to ResearchAndMarkets.com's offering. The global advanced IC substrate market is undergoing a significant transformation, ...
Korea JoongAng Daily on MSN
LG Innotek develops next-gen substrate for smart cards, cuts carbon emission by half
LG Innotek has developed a next-generation smart IC (integrated circuit) substrate, a core component in smart cards, that ...
Taiwan-based CCL manufacturer Elite Material (EMC) has disclosed plans to issue NT$3.5 billion (US$125.7 million) in convertible corporate bonds to fund its capacity expansion for CCL materials needed ...
For 2026, the company said the order-Intake outlook is about 20% higher compared to 2025. Three reinforcing growth vectors in place, the company said: ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
Bernin (France), June 13, 2024 — Soitec (Euronext Paris), a world leader in designing and manufacturing innovative semiconductor materials, today announced the expansion of its partnership with UMC, a ...
For years, many in the semiconductor industry have focused on the march toward advanced nodes. As these nodes have decreased in size, the size of input/output (I/O) bumps on the chip has grown smaller ...
Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...
The "The Global Market for Glass Substrates for Semiconductors 2026-2036" report has been added to ResearchAndMarkets.com's offering. The Global Glass Substrate for Semiconductors Market 2026-2036 ...
LG Innotek said Wednesday it has developed a next-generation smart IC substrate that cuts carbon emissions by about half and boosts durability threefold — a breakthrough the company says positions it ...
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