Driving R&D of glass components for scaling of semiconductor packaging substrates Tokyo, Japan, December 16, 2025 -- TOPPAN ...

The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

Samsung and Intel are known for having a troublesome journey in the semiconductor field. Both companies are often overshadowed by NVIDIA, AMD, and TSMC. However, things might change soon as Samsung is ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global PCB landscape. Henry ...

FREUDENSTADT, Germany, Oct. 08, 2025 (GLOBE NEWSWIRE) -- SCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product ...

Rapidus, Japan's state-backed chipmaker, has developed a prototype glass interposer for artificial intelligence chips. The ...

Nvidia Corp’s (NASDAQ:NVDA) demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (NYSE:TSM) remains robust despite its evolving technology requirements, Reuters cites Nvidia chief ...

LG Innotek has developed a next-generation smart IC (integrated circuit) substrate, a core component in smart cards, that ...

TOKYO and SEOUL, South Korea, Nov. 5, 2025 /PRNewswire/ -- Samsung Electro-Mechanics announced on the 5th that it has signed a memorandum of understanding (MOU) with Sumitomo Chemical Group to ...

With the Cu-Post technology, LG Innotek can squeeze almost 20% more solder balls onto the semiconductor substrate. The technology minimizes the area and size of the solder balls thus allows the denser ...

Samsung is considering using Intel’s packaging and glass substrate technology to give its production line a boost. The tie-up between the firms might elevate their game and could finally outperform ...