ASMPT Secures Additional Orders for Fifteen Chip-to-Substrate Thermo-Compression Bonding Tools Driven by AI Tailwind

ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and ...

Semiconductor Advanced Substrate Market to Reach USD 14.63 Billion by 2031, Driven by Advanced Packaging and Heterogeneous Integration | Valuates Reports

The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...
Korea JoongAng Daily on MSN

LG Innotek develops next-gen substrate for smart cards, cuts carbon emission by half

LG Innotek has developed a next-generation smart IC (integrated circuit) substrate, a core component in smart cards, that ...
Electronics Weekly

Substrate market to be worth $31bn by 2030

The substrate market will be worth $31 billion by 2030 driven by AI and HPC, says Yole, spanning Advanced IC Substrates (AICS), Glass Core Substrates (GCS), Substrate-like PCB (SLP), and Embedded Die ...
AzerNews

LG Innotek creates low-emission next-gen smart IC substrate

LG Innotek Co., a leading South Korean electronics parts manufacturer, announced on Wednesday that it has developed a next-generation smart integrated circuit (IC) substrate that reduces carbon ...

ASMPT Secures Additional Orders for 15 Chip-to-Substrate Thermo-Compression Bonding Tools — AI Tailwind

ASMPT wins repeat orders for 15 C2S TCB tools from a major OSAT partner, positioning to capture significant share of a ...