Laser technology could eliminate the need for adhesive glue in paper packaging, according to peer-reviewed research that has ...

(Nanowerk News) An ultra-stable, ultra-thin bonding technology has been adapted by researchers in PML’s Semiconductor and Dimensional Metrology Division at NIST for use as a super-strong vacuum seal.

Regardless of object size, it’s good practice to know which methods of bonding can be employed using thermoplastic resin and how to avoid the pitfalls associated with using the wrong approach ...