Plastic is a vital material for modern healthcare applications because of its versatility. Its uses have continued to evolve along with this dynamic industry. However, this can present some ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

> Sanofi-aventis has implemented Lanner's process simulation software at a U.K. facility, following a pilot implementation that yielded $1.65 million in inventory cost savings in six months. Release ...

NEW YORK, June 25, 2026 /PRNewswire/ -- rePurpose Global, the world's leading Packaging Compliance and Sustainability Platform, today announced the launch of the Packaging Simulator, a ...

As packages get larger and thinner, warpage is becoming a process-control problem rather than a simple flatness spec.