James Li, Chairman and Chief Executive Officer of Nature's Miracle, commented, "Driven by our attendance at GreenTech Amsterdam 2024 where we've engaged with global horticultural technology and ...
The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...
PITTSBURGH--(BUSINESS WIRE)--PPG (NYSE:PPG) today announced the introduction of PPG TESLIN® EMI/RF (electromagnetic interference/radio-frequency) shielding material ...
Ziptronix, a leader in innovative integration solutions, announced today the first in a line of Engineered Substrates products. Based on the company's ZiROC bonding technology, Temperature Compensated ...
The display glass substrate market, which had suffered a prolonged slump, rebounded to post a record quarterly revenue. This result came as companies including U.S.-based Corning and Japan's Asahi ...
The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...
[Asia Economy Reporter Suyeon Woo] LG Innotek is participating in the 'International Electronic Circuit and Mounting Industry Exhibition (KPCA show 2021)' held from the 6th to the 8th of this month at ...
LG Innotek (CEO Moon Hyuksoo) announced on December 22 that the company has successfully developed a 'Next-Generation Smart ...
South Korean semiconductor equipment supplier Neontech's new product, "TB Cleaning Saw & Sorter," a tool for ABF substrate packaging, has penetrated the Chinese market and won... Nan Ya PCB, among ...
Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and ...