ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and ...

The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

Rapidus plans to outline its early-stage work on panel-level packaging using 600 × 600 mm glass substrates at SEMICON Japan, ...

TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

South Korean giants Samsung Electronics and SK Group are "speeding up efforts" to secure future dominance in glass substrates, which would be a "game-changer" for the semiconductor and AI industries.

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

Samsung Electro-Mechanics and LG Innotek are accelerating their AI semiconductor substrate businesses. Samsung Electro-Mechanics recently started operating its Vietnam flip chip-ball grid array ...

Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential withdrawal amid ...

The Wide Bandgap Semiconductor Market is gaining strong momentum due to rising demand for energy-efficient power devices across electric vehicles, renewable energy systems, fast chargers, data centers ...

ASMPT wins repeat orders for 15 C2S TCB tools from a major OSAT partner, positioning to capture significant share of a ...