Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...
The "Advanced IC Substrates Market Size, Share & Industry Analysis Report By Type, By Technology, By Application, By Regional Outlook and Forecast, 2025-2032" report has been added to ...
Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from... Unimicron ...
The "Global Advanced IC Substrate Market 2025-2035" report has been added to ResearchAndMarkets.com's offering. The global advanced IC substrate market is undergoing a significant transformation, ...
Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
Korea JoongAng Daily on MSN
LG Innotek develops next-gen substrate for smart cards, cuts carbon emission by half
LG Innotek has developed a next-generation smart IC (integrated circuit) substrate, a core component in smart cards, that ...
Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...
While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...
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