Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...

First-of-a-kind SiC epitaxial substrate manufacturing facility in Europe Full vertical integration to reinforce substrate supply for SiC devices and solutions enabling automotive and industrial ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

The "Global Advanced IC Substrate Market 2025-2035" report has been added to ResearchAndMarkets.com's offering. The global advanced IC substrate market is undergoing a significant transformation, ...

The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

As global chipmaking leaders like Intel are optimistic about introducing glass substrates for advanced IC packaging, Japan-based PCB suppliers are capitalizing on the emerging technology. Save my User ...

Glass substrates could be the key to linking up massive multi-chiplet processors of the near(ish) future. When you purchase through links on our site, we may earn an affiliate commission. Here’s how ...

BOSTON, MA, UNITED STATES, February 18, 2025 /EINPresswire.com/ -- UniversityWafer, Inc., a global leader in advanced semiconductor substrates, is proud to announce ...

What just happened? Startup Ephos is going all-in on glass photonic chips, an emerging technology with the potential to reshape the entire semiconductor industry. The company recently announced an ...

PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL).