Nvidia CEO Jensen Huang highlighted key Taiwanese suppliers central to its AI chip packaging and testing ecosystem. These ...

TL;DR: NVIDIA’s B300 AI chip production is accelerated to May, utilizing TSMC’s advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs ...

Nvidia is pushing production of its new B300 AI chip forward to May, using Taiwan Semiconductor Manufacturing’s latest 5nm (N4P) process and CoWoS-L advanced packaging technology. Sources at ...

(Reuters) -Dell Technologies (DELL) on Monday unveiled new servers powered by Nvidia's (NVDA) Blackwell Ultra chips, aiming to capitalize on the booming demand for artificial intelligence systems.

Nvidia has allegedly delayed the introduction of its upcoming SOCAMM technology with an upcoming Blackwell enterprise GPU. ZDNet reports that SOCAMM is now scheduled to arrive with next-generation ...

From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March, to TSMC's North America Technology Symposium in April, and the ...

As an Amazon Associate, we earn from qualifying purchases. TweakTown may also earn commissions from other affiliate partners at no extra cost to you. TL;DR: NVIDIA CEO Jensen Huang revealed at ...

Being the first to deploy GB200 Grace Blackwell systems at scale underscores our commitment to delivering superior performance and efficiency to our customers.” The deployment of Nvidia’s ...

TSMC plans to roll out CoWoS-L with 4,719 mm² interposers and 100×100 mm substrates, supporting up to 12 HBM stacks—likely targeting Nvidia’s Rubin lineup and other heavyweight compute gear.

Nvidia's Blackwell production is moving to the U.S. over the next few months. Nvidia recently had to take a charge on GPUs designed for China. The stock is almost priced at the same level as the ...