New TPU; TSMC revenue, export investigation; global semi equipment sales; 2D materials roadmap; acquisitions; UALink spec; EU ...

Controlling film thickness to precise specifications is essential for ensuring high yield in high-performance devices.

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

IC ecosystem; UPF 4.0; AI readiness; auto, industrial chiplet SW; PCIe 6; 3D thermal analysis; rad-hard simulation.

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

The AI Readiness Index Report provides a valuable benchmark against which organizations can measure their AI maturity. For ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

With each iteration, PCIe has not only increased data bandwidth but also introduced innovations aimed at enhancing power efficiency—a critical factor in today’s energy-conscious computing environment.

A new technical paper titled “The 2D Materials Roadmap” was published by researchers at many institutions including Chinese ...

Key applications for GenAI and the features they enable, as well as an examination of how model growth and differing model ...