At OFC 2025, imec unveiled a proof of concept for a photonics-based CDM FMCW 144-GHz distributed radar system, which could ...

Hybrid circuit protection devices, using a combination of technologies, provide better protection for industrial Ethernet ...

At Auto Shanghai, Intel unveils its next-gen AI-enhanced SDV SoC, claiming the automotive industry’s first multi-node chiplet ...

Renesas Electronics introduces the RA0E2 MCUs with ultra-low power consumption and an extended temperature range.

Molex’s new report finds that advanced connector design is needed for constant connectivity in military, avionics, and ...

L-com expands its connector portfolio with rugged Bulgin circular connectors and other interconnects for harsh environments.

Vishay’s ISOA200 thick-film power resistors with optional NTC thermistor and phase-change thermal interface material saves ...

Littelfuse’s IXD2012NTR high-side and low-side gate driver drives two N-channel MOSFETs or IGBTs in a half-bridge ...

Allegro’s CT4022/32 TMR current sensors claim ultra-low noise and high-precision current measurements for clean energy ...

Microchip’s highly integrated MCPF1412 power module saves space and delivers flexible configuration and monitoring.

Navitas’ SiCPAK power modules claim a 5× lower thermal resistance shift after 1,000 cycles of thermal shock testing.

JEDEC announced the publication of the HBM4 DRAM standard, delivering higher bandwidth, efficiency, and capacity for AI and ...