Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has ...

Chiplets will be a key enabler for customizing designs at every level, from edge devices to the cloud. AI is a key driver, ...

Chip smuggling; AI export controls; Middle East AI deals; DeepSeek's new report; OSAT revenue up; AI PC memory chipsets; big ...

Supply chain vulnerabilities, hardware attacks, and communications hacks are rife. Autonomous technology poses extra threats.

High-voltage PCB spacing; HBM4; AI changes engineering teams; ion beam etching; wafer market and raw materials.

Rooting out the causes of silent data corruption errors will require testing improvements and much more. Silent data errors ...

A new technical paper titled “Hardware vs. Software Implementation of Warp-Level Features in Vortex RISC-V GPU” was published ...

Smartly designed metrology solutions delivering precise measurements enable manufacturers to maintain yield and productivity ...

Benchmarking 3D-IC cooling; rad-hard flip-flops; high-speed data error correction. Researchers from Massachusetts Institute ...

A new technical paper titled “Key Safety Design Overview in AI-driven Autonomous Vehicles” was published by researchers at ...

A new technical paper titled “Computing with Printed and Flexible Electronics” was published by researchers at Karlsruhe ...