The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance ...

Award Recognizing Numerous Contributions to Be Presented at ECTC 2025 Dick Otte, CEO, Promex Industries Promex Industries CEO ...

The "Advanced Packaging Market Size, Share & Trends Analysis Report by Packaging Type (Flip-Chip, Fan-Out WLP, Embedded-Die, Fan-In WLP, 2.5D/3D), Application (Consumer Electronics, Automotive, ...

US e-commerce giant Amazon has rolled out a new packaging design for its electronic devices, boasting that it is 100% recyclable. The revamped packaging, which began distribution this October ...

A new technical paper titled “Computing with Printed and Flexible Electronics” was published by researchers at Karlsruhe ...

The company is the recipient of ReMA’s 2025 Design for Recycling Award, the association’s “most prestigious honor.” ...