When we first started The Next Platform a decade ago, there was not really much of a reason to cover the company’s datacenter ...

We recently published a list of Top 11 AI News and Ratings You Should Take a Look At. In this article, we are going to take a look at where Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM ...

The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor ...

APT’s net profit expanded 24.5 percent to NT$607.62 million during the first three quarters of last year, compared with ...

Intel says its new Falcon Shores AI accelerator won't see the light of day, shifts its focus into next-gen Jaguar Shores ...

Discussions also took place on next-generation advanced packaging technology (CoWoS-L) necessary for AI accelerator manufacturing, as well as processes that are nearing commercialization, such as ...

Specifically, Nvidia is transitioning from CoWoS-S to CoWoS-L, representing a significant advancement in its chip architecture as well as a major shift for TSMC. Speaking on the sidelines of an ...

Nvidia has so far relied mainly on one type of CoWoS technology, CoWoS-S, to combine its AI chips. Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it ...

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system has now fully entered production, which will gradually enhance CoWoS-L ...

Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced packaging technology offered ...