Technical Paper Research Organizations STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration Penn State Univ. Intel, Arizona State Univ. and Univ. of Notre Dame CFET ...

ANAHEIM, Calif. — As Gene Simmons sat in his dressing room at Madison Square Garden on Dec. 2, 2023, the final night of the End of the Road Tour, the singer-bassist of Kiss cleaned off his Demon ...

Despite strong fourth-quarter earnings, the company expects profit and revenue below Wall Street estimates. Increased reliance on per-chip royalties and shifting demand patterns make annual guidance ...

In this context, the exploitation of electrochemical paper-based analytical devices (ePADs) is still in its infancy, but is particularly promising in the detection of APIs and excipients in tablets, ...

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