Siemens Digital Industries Software today announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional ...

Siemens is a founding partner of the Intel Foundry Accelerator Chiplet Alliance – enabling a new and compelling  solution for ...

Conventional flexible PCBs, built around plastic polyimide, are also ripe for alternative materials. Polylactic acid, ...

The range of topics to be covered at ECTC 2025 encompasses heterogeneous integration, photonics, components, materials, assembly, reliability, modeling, interconnect design and technology, ...

Soaring demand for AI servers has propelled Taiwan's ABF substrate leaders—Unimicron Technology, Kinsus Interconnect ...

Demis Hassabis, CEO of Google DeepMind, offered details about the future of Gemini AI, AGIs, and self-aware systems.

Debye Institute for Nanomaterials Science and Institute for Sustainable and Circular Chemistry, Department of Chemistry, Utrecht University, 3584 CG Utrecht, The Netherlands Van’t Hoff Institute for ...

Davis International Center (IC) Director Albert Rivera said the University was monitoring the visa statuses of international students in an email to international students and scholars on Monday ...

LPKF’s LIDE technology excels in microprocessing defect-free through glass vias (TGV) for advanced glass substrates. Onto Innovation’s Firefly® system provides an automated inspection and metrology ...

Onto Innovation’s Firefly ® system provides an automated inspection and metrology solution for advanced IC substrates and panel level packaging. In a further step to enable process and supply ...