The inefficiency prevailing in the Federal Board of Revenue (FBR) offices has made the lives of people miserable. Previously, the FBR staff used to update applicants’ data within an hour ...

HERE'S the continuation of my conversation about the perils of packaging waste and pollution with Eric Manalang, a respected packaging expert in the Philippines and Australia. Unless we stop throwing ...

Packaging and design are the body and soul of any product. It is critical for a company trying to sell its product or service to get both correct. The challenge is not just getting it correct, but ...

Packaging company Printmann Offset Pvt Ltd, which is backed by healthcare-focussed private equity firm Somerset Indus Capital Partners, has acquired a controlling stake in a South Indian paper ...

Kennedy Jr. said he's considering major changes in how food packaging is regulated, and he wants more focus on human health risks from microplastics and chemicals used in polymers. While some ...

The AI boom has ushered in unprecedented opportunities, but it has also created significant challenges in packaging, pricing and selling AI-driven products. As a product leader at an AI company ...

"After nine successful years of operating Viva Foam, we have made the strategic decision to focus more on our core corrugated packaging business," said Joseph Palmeri, chief operating officer at ...

Cloud-based software services major Zoho Corporation's co-founder, Sridhar Vembu, on Friday, April 18, flagged that India's IT sector and the software industry are facing inefficiency issues amid ...

At the Capitol Hill steps joined by House and Senate Democrats, Sen. Lisa Blunt Rochester remarks on the disasters of Donald Trump's first 100 days in office, including DOGE's dismantling of the ...

As sustainability regulations continue to reshape industries around the world, the packaging sector stands at the vanguard of the circular economy transition. Initiatives such as extended producer ...

TL;DR: NVIDIA’s B300 AI chip production is accelerated to May, utilizing TSMC’s advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs ...